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HP Z2 Mini G1a Workstation Desktop PC
HP (OBM) / Inventec (ODM)
Industrial Design Lead
A compact workstation built for high-performance workflows, enabling 3D design, rendering, and AI-accelerated computing in a minimal desktop. Its setup brings workstation power into a small footprint, fitting into modern workspaces.
Industrial Design / CMF / DFM / Product Development / Cross-Functional Collaboration / Mass Production
CHALLENGE & APPROACH
Problem
The previous Z2 Mini Workstation (G9) already had a strong compact workstation identity, but the new generation needed to support heavier AI, 3D design, rendering, and multi-app workflows. The challenge was to make it feel more powerful without making it look bulky.
Constraints
The design had to balance airflow, internal layout, service access, I/O placement, flexible installation, and mass production requirements.
Design Focus
The design was shaped by airflow, placement flexibility, and a more performance-driven workstation identity. The front grille, rear ventilation, compact enclosure, rotatable slash logo, AI badge, side I/O, rubber feet, and rack design helped the product feel efficient, flexible, and ready for any workflows.
Stronger Airflow Design
Cleaner Front & Rear Layout
More Performance-Driven
Better Placement Flexibility
Compact, Stronger Presence
PRODUCT DEVELOPMENT SCOPE / PROCESS
Product Definition
previous generation review
project scope alignment
early requirement review
hard requirements spec
usage scenario setting
Design Development
form design
3D modeling
product profile
overview layout
HP review
Design Build & DFM
prototype review
part breaks
assembly logic
detail adjustment
manufacturability checks
System Integration
ventilation design
internal layout
I/O placement
CMF direction
overview consistency
Product Validation & Mass Production
product testing
SVTP testing
cosmetic checks
CMF review
final DFM & assembly refinement
My Role
Industrial Design Lead — led product development, 3D modeling, DFM & CMF coordination, and design detail refinement. Working with HP, Inventec and engineering teams from initial design build to mass production phase.
HIGHLIGHTS
DESIGN
A compact workstation designed with optimized airflow, rackable design, and flexible setup for professional workflows.
Power Button (LED, indicates system status.)
AI Badge (Identified as product built for AI workflows.)
HP Rotatable Slash Logo (Co-molded structure with plating finish, high-gloss appearance.)
Expanded Air Intake
Compared to last generation, larger diamond openings and ventilation area increase the front air intake, helping airflow move more efficiently.
Front Grille
Recessed from the front surface, it's layered from the inner mesh to the outer interwoven structure, with matte to gloss finish contrast.
Rear Grille
Corresponding to front grille design and support heat exhaust from inside.
Rear I/O (RJ-45, USB-A, Power, Thunderbolt, Mini DisplayPort, and optional Flex I/O.)
Latch Slider (Enables quick, tool-less access to slide open top cover.)
Bottom Rubber Feet (Provides surface grip and placement stability.)
Side I/O (USB-A, USB-C, audio jack.)
Clam Shell Case (Updated from previous anodized coating metal shell to painted matte black plastic shell.)
Slide-Off Top Cover
The top cover can slide back and lift off for service access.
Z2 Mini G9 (Previous Generation)
211 mm / 8.3 in
218 mm / 8.6 in
69 mm / 2.7 in
Z2 Mini G1a (Now Generation)
168 mm / 6.6 in
200 mm / 7.9 in
Larger diamond openings
Expanded front air intake area
Added AI badge
Added side rubber feet
Consistent pattern design
85.5 mm / 3.4 in
Larger diamond openings
Expanded rear exhaust area
More I/O options
Reorganized rear grille layout
Consistent pattern design
Removed side HP slash logo
More Streamlined side I/O
20% narrower width
8% shorter depth
24% taller height
Fits Anywhere.
Z2 Mini G1a can mount behind monitor, sit or attach under desk. It can also fit in rack, and its small size allows for 5 units across 4U rack.
STRUCTURE
Air Intake
Cool air enters the high-airflow 3D mesh intake, is drawn across the fan module, and then reaches the thermal system.
Heat Exhaust
Phase change APU cooling transfers heat into thermal module and tuned airflow moves heat out.
Cooling Built Into The Form.
Front Grille (Vent)
Fan Module
Heat Sink
Rear Grille (Vent)
Systematic. Engineered.
The internal architecture organizes the system chassis, system board, fan module, heat sink, SSD, and Flex I/O into a compact and accessible layout, built for professional and high-performance workflows.
(Internal components may differ from images shown based on different configurations)
Rear Frame
Flex I/O Board
Latch Structure
System Board
SSD
Front Frame
Middle Frame
Compact and Sleek.
Designed for flexible placement, on desk, behind monitor, under desk, or even in a rack with support for 5 units in 4U.
Intelligent Thermal.
Phase change APU cooling, high-airflow 3D mesh air intake, fan module, and BIOS power control the system.
(source: Notebookcheck)
AI Performance.
Powered by AMD Ryzen AI Max PRO Series processors with up to 50 NPU TOPS. Built for AI-accelerated workflows.
Memory and Storage.
Up to 128 GB unified memory and 8 TB through dual NVMe modules with RAID capability, designed for professional use.
Packed with Ports.
Include Mini DP 2.1, Thunderbolt 4, USB-A, USB-C, 2.5GbE DASH, audio, and support two Flex I/O modules.
For Professional.
Positioned for product designers and engineers, software developers, creative media professionals, and AEC teams.
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More Than A Mini Workstation.
Key Features Drive Performance.
My Role
Industrial Design Lead — collaborated with cross-functional teams at HP and Inventec from concept to mass production. My role focused on ideation, form development, 3D modeling, CMF, DFM, design detail communication, and mass production process with engineering teams.
Disclaimer
This project was completed at Inventec in collaboration with HP and was publicly released in 2025 as the HP Z2 Mini G1a Workstation. HP product names, trademarks, and selected brand assets are the property of HP Inc. This page is presented for portfolio purposes only.
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